Mechanical and Kinematic Design of Surgical Mini Robotic Manipulator used into SP-LAP Multi-DOF Platform for Training and Simulation

Jose Cornejo, Jorge A. Cornejo-Aguilar, Cristians Gonzalez, Raul Sebastian

Resultado de la investigación: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

15 Citas (Scopus)

Resumen

Surgical robotics is the new age of minimally invasive procedures, for this reason, it is important to acquire fundamental skills using training and simulation. Therefore, a research study was developed to present the design of 2 robotic arms, which are used into SP-LAP training platform for remote control haptic manipulation in order to magnify natural eye-hand-instrument alignment, boost motor dexterity and minimally invasive, enhance ergonomics, ensure feasibility, safety, and patient risk reduction. The proposed medical robotic manipulator has 3 degrees of freedom (DOF), 4 links and 3 joints, which have 9 DOF in combination with the multi-DOF system, to promote the application for new surgical techniques and approaches, based on the ergonomics during triangulation. In conclusion, the analysis is focused on mechanical 3D design and kinematics. The next step of the project is to evaluate adding 2 DOF more, and also work on the mechatronic integration of sensors and actuators, and then, perform test and validation of the cyber-physical system.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2021 IEEE 28th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2021
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9781665412216
ISBN (versión impresa)9781665412216
DOI
EstadoPublicada - 5 ago. 2021
Publicado de forma externa
Evento28th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2021 - Virtual, Lima, Perú
Duración: 5 ago. 20217 ago. 2021

Serie de la publicación

NombreProceedings of the 2021 IEEE 28th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2021

Conferencia

Conferencia28th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2021
País/TerritorioPerú
CiudadVirtual, Lima
Período5/08/217/08/21

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