Conceptual Technical Design of 3-Dimension Rotational Clinostat for Microgravity Simulation focused on Agro-Engineering Applications for Small Plants Cultivation

Ricardo Barreto, Jose Cornejo, Juan Carlos Suarez-Quispe, Carlos Nina Ochoa

Resultado de la investigación: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

2 Citas (Scopus)

Resumen

In this project, the conceptual design of an innovative mechanism for 3-Dimensional Clinostat (3 Degrees of Freedom - DOF) is proposed, and it has an innovative mechanism configuration to introduce advanced motion with a single-engine is shown in order to simulate microgravity conditions on small living beings such as plants or cell cultures. The simplification to a single engine could reduce the production cost and its size, resulting in a better low-cost homemade simulated microgravity compared with experiments during spaceflight using more sophisticated equipment, encouraging the new possibilities of research for scientists to explore this field. The further objective of this work is to use this machine to analyze the physiology and biochemical changes of cherry tomatoes with the aim to be a source of nutrition for astronauts in space. This research is a pioneering resource in Latin America for portable and laboratory usage in space agriculture engineering, developed by the Center for Space Emerging Technologies (C-SET).

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas1-4
Número de páginas4
ISBN (versión digital)9781665486361
ISBN (versión impresa)9781665486361
DOI
EstadoPublicada - 2022
Publicado de forma externa
Evento29th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022 - Lima, Perú
Duración: 11 ago. 202213 ago. 2022

Serie de la publicación

NombreProceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022

Conferencia

Conferencia29th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
País/TerritorioPerú
CiudadLima
Período11/08/2213/08/22

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