Agro-Engineering Methodology Analysis of Nutritional Values of Solanum Lycopersicum Var. Cerasiforme under Simulated Microgravity for Crop Applications during Spaceflight

Ricardo Barreto, Jose Cornejo, Diego Orihuela Tacuri, Jorge A. Cornejo-Aguilar

Resultado de la investigación: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

3 Citas (Scopus)

Resumen

In this project, Center for Space Emerging Technologies (C-SET) presents a proposal to study the effect of microgravity on the growth of plants with fruits like the Solanum Lycopersicum Var. Cerasiforme (Cherry tomatoes), and analyze the differences between Earth and 3D-clinostat simulator conditions focus on biochemical and physiological changes using: a) High-Performance Liquid Chromatography (HPLC) for vitamins, b) Atomic Absorption Spectroscopy for minerals, and c) Morphological Analysis for biophysical variations. At the same time, the guided growth conditions and environmental factors (greenhouse) will be controlled in order to have reproducibility and repeatability with the aim to replicate on other plants and space crops, encouraging other researchers to follow this methodology for the usage in testing with other fruit species.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas1-4
Número de páginas4
ISBN (versión digital)9781665486361
ISBN (versión impresa)9781665486361
DOI
EstadoPublicada - 11 ago. 2022
Publicado de forma externa
Evento29th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022 - Lima, Perú
Duración: 11 ago. 202213 ago. 2022

Serie de la publicación

NombreProceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022

Conferencia

Conferencia29th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
País/TerritorioPerú
CiudadLima
Período11/08/2213/08/22

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