A comparison of performance between fully and partially decentralized applications

Ken M. Kina-Kina, Helmut E. Cutipa-Arias, Pedro Shiguihara-Juarez

Resultado de la investigación: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

4 Citas (Scopus)

Resumen

In Blockchain platforms, programs prioritize the immutability and traceability of stored data. These programs, known as DApps (Decentralized Applications), inherit Blockchain platform capabilities and they have two categories: fully DApp and partially DApp. In related work, software architectures for DApps have been applied to medical history, supply chain, loyalty programs among others. Fully and partially DApps have different advantages and limitations according to a purpose. In this paper, we propose a software architecture for a fully DApp and a partially DApp focused on simulating assets transactions to compare both DApps performance. We identify their advantages and disadvantages focused on performance for asset transactions. On average, partially DApp provides the frontend 44.82% more quickly than fully DApp when there are around 100 concurrent requests per second. Also, partially DApp processes between 23% and 26% more requests per second than fully DApp when the number of concurrent requests is above 250.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9781728136462
DOI
EstadoPublicada - ago. 2019
Publicado de forma externa
Evento26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019 - Lima, Perú
Duración: 12 ago. 201914 ago. 2019

Serie de la publicación

NombreProceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019

Conferencia

Conferencia26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
País/TerritorioPerú
CiudadLima
Período12/08/1914/08/19

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