TY - GEN
T1 - Approaches based on tree-structures classifiers to protein fold prediction
AU - Shiguihara-Juarez, Pedro
AU - Mauricio-Sanchez, David
AU - De Andrade Lopes, Alneu
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/10/20
Y1 - 2017/10/20
N2 - Protein fold recognition is an important task in the biological area. Different machine learning methods such as multiclass classifiers, one-vs-all and ensemble nested dichotomies were applied to this task and, in most of the cases, multiclass approaches were used. In this paper, we compare classifiers organized in tree structures to classify folds. We used a benchmark dataset containing 125 features to predict folds, comparing different supervised methods and achieving 54% of accuracy. An approach related to tree-structure of classifiers obtained better results in comparison with a hierarchical approach.
AB - Protein fold recognition is an important task in the biological area. Different machine learning methods such as multiclass classifiers, one-vs-all and ensemble nested dichotomies were applied to this task and, in most of the cases, multiclass approaches were used. In this paper, we compare classifiers organized in tree structures to classify folds. We used a benchmark dataset containing 125 features to predict folds, comparing different supervised methods and achieving 54% of accuracy. An approach related to tree-structure of classifiers obtained better results in comparison with a hierarchical approach.
UR - http://www.scopus.com/inward/record.url?scp=85040015320&partnerID=8YFLogxK
U2 - 10.1109/INTERCON.2017.8079723
DO - 10.1109/INTERCON.2017.8079723
M3 - Contribución a la conferencia
AN - SCOPUS:85040015320
T3 - Proceedings of the 2017 IEEE 24th International Congress on Electronics, Electrical Engineering and Computing, INTERCON 2017
BT - Proceedings of the 2017 IEEE 24th International Congress on Electronics, Electrical Engineering and Computing, INTERCON 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th IEEE International Congress on Electronics, Electrical Engineering and Computing, INTERCON 2017
Y2 - 15 August 2017 through 18 August 2017
ER -